近日，中国科学院长春光学精密机械与物理研究所黎大兵团队实现了片上热利用。该项研究成果发表在2026年6月2日出版的《光：科学与应用》杂志上。

芯片的集成化与微型化导致显著的功耗和热量积累。通常情况下，冷却系统的能耗占输入能量的50%以上。当前的热管理技术无法解决片上热能损失的问题。

研究组提出一种片上集成热回收系统，该系统能够同时实现高效散热。他们提出的片上系统基于水伏发电机技术，由电极和凝胶构成。以存在严重热积累问题的深紫外LED（236 nm）芯片为原型，在集成该热回收系统后，不仅能将芯片温度维持在40 °C以下，还能将废热转化为存储的电能，从而使整体能源利用效率提升610.70%。为了证明该技术在商用CPU系统中的通用性，研究组以商用Intel G3220芯片为例，通过集成四个水伏发电机单元，将其温度从93 °C降低至60 °C以下，有效提升了计算性能并延长了芯片的使用寿命。

附：英文原文

Title: Thermal Utilization on Chip

Author: Zhang, Yaohao, Lai, Bo, Yu, Fei, Li, Xuesong, Yang, Yue, L, Wei, Jiang, Ke, Sun, Xiaojuan, Li, Dabing

Issue&Volume: 2026-06-02

Abstract: The integration and miniaturization of chips lead to significant power consumption and heat accumulation. Typically, the energy consumption of cooling systems accounts for morn than 50% of the input energy. Current thermal management technologies do not offer solutions for on-chip thermal energy loss. Herein, we propose an on-chip integrated thermal recovery system, which can simultaneously achieve efficient heat dissipation. Present system on chips is based on hydrovoltaic generator technology, consisting of electrodes and gel. With the deep ultraviolet LED (236nm) chip suffering from severe heat accumulation as a prototype, upon integration with the thermal recovery system, not only maintain the chip temperature below 40°C, but also converts waste heat into stored electrical energy, resulting in a 610.70% improvement in overall energy utilization efficiency. To demonstrate its general applicability in commercial CPU systems, we used the commercial Intel G3220 chip and as an example, by incorporating four HEG units, the temperature was reduced from 93°C to below 60°C, effectively enhancing computational performance and extending the chip’s lifespan.

DOI: 10.1038/s41377-026-02326-1

Source: https://www.nature.com/articles/s41377-026-02326-1